发明名称 Semi-conductor device
摘要 A semiconductor device has a fuse element formed on an insulating substrate, and a first insulating layer formed on the substrate and covering the fuse element. Further insulation on the first insulating layer nitride has an opening exposing the region of the first insulating layer above said fuse.
申请公布号 HK45795(A) 申请公布日期 1995.04.07
申请号 HK19950000457 申请日期 1995.03.30
申请人 SEIKOSHA CO LTD 发明人 KOJI MACHINDA;HIDEYUKI NAKAMURA;HIROSHI TONEGI
分类号 H01L21/82;H01L23/525;H01L27/10;(IPC1-7):H01L23/52 主分类号 H01L21/82
代理机构 代理人
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