| 摘要 |
<p>A maturated moldable thermosetting resin-containing composition for molding under pressure at an elevated temperature in which the curable resin system consists essentially of (A) an unsaturated polyester resin having 5 hydroxyl groups and carboxyl groups and (B)(1) an organic polyisocyanate, (B)(2) a metallic oxide or hydroxide, and (B)(3) a polyamine for reacting with the polyisocyanate, said reaction product containing dispersed therein, (C) an aliphatically unsaturated monomer, (D) a free radical polymerizationcatalyst, (E) an internal mold release agent and either or both of (a) reinforcing fibers and (b) inert fillers. In addition, the inclusion of (F) thermoplastic additives for low-shrink control is an optional part of this invention, and (G) also includes additives used to reduce matrix viscosity and modify resin cure gel times.</p> |
