METHOD OF PROTECTING SOLDERABLE COPPER AND COPPER-ALLOY SURFACES FROM CORROSION

摘要

Proposed is a method of protecting solderable copper and copper-alloy surfaces from atmospheric corrosion, the method calling for the surface of the metal to be contacted with a solution of one or more sulphur compounds of the formula (I): R<2>-A<1>-S-R<1>, in which R<1> is hydrogen or a group of the formula: -S-A<2>-R<3>, A<1> and A<2> are straight-chain or branched-chain C4-C30 alkyl groups and R<2> and R<3> are hydrogen atoms or hydroxyl groups, the surface then being rinsed if necessary and finally dried.