| 摘要 |
<p>A copper alloy for electric and electronic components which contains 1.8-2.0 wt.% of iron, 0.025-0.040 wt.% of phosphorus, 1.7-1.9 wt.% of zinc, 0.40-1.0 wt.% of tin, 0.0001-0.01 wt.% of calcium, and the balance comprising copper and inevitable impurities. The alloy may further contain 0.001-0.01 wt.% in total of at least one element selected between 0.001-0.01 wt.% of chromium and 0.001-0.01 wt.% of magnesium. This alloy serves to solve the problem of prior art such that ingot cracking is apt to occur during heating or hot working in the hot working step, to prevent short-circuiting caused by the copper migration often occurring in accordance with an increased tendency toward higher-density electric and electronic components, to improve the service life (wear resistance) of molds, and to reduce the production cost.</p> |
