| 摘要 |
The multi-chip module comprises a ceramic multi-layer substrate, chip-type electronic parts mount-bonded to the surface of predetermined areas of the ceramic multi-layer substrate, a seal-ring pattern positioned on the surface of the ceramic multi-layer substrate having enclosed a packaging area of the electronic parts, a sealing cap for packaging the electronic parts by sealing open edge to the seal-ring pattern, and pads for mounting input/output terminal leads or pins, which are installed with wires elongated from internal layers of the substrate to the ceramic multi-layer substrate through lead-throughs distributed along the sealing cap, wherein the pads are aligned in a row or alternately aligned in two rows along the sealing cap and the leading parts of the via holes and the pads are alternately aligned in two rows. The multi-chip module manufacturing method comprises; manufacturing a ceramic multi-layer substrate, wherein the pads for mounting input/output terminal leads or pins are aligned in a row or alternately aligned in two rows along the sealed part having the internally wired leading part of the via holes alternately aligned in two rows in the peripheral area; mount-bonding the desired chip-type electronic devices onto the manufactured substrate; and soldering the input/output terminal pins to the pads positioned on the peripheral area onto which the chip-type electronic devices are mount-bonded, using a solder, the melting point of which is 400 DEG C or lower. <IMAGE> |
