| 摘要 |
PURPOSE:To provide uniform polishing further with small damage, in a polishing device for flattening a surface of semiconductor wafer or the like formed with a coating film. CONSTITUTION:A disk 13 and a weight 15 are mounted on an intermediate part of a lever 14, having a supporting point in one end part, and on the other end part respectively, to fix a magnet 18 to a lower part of the weight 15, and an electromagnet 19 is arranged adjacent to the lower of the magnet 18. A workpiece polished object (wafer) 1 is mounted on a lower surface of the disk 13, to polish the wafer pressed to a rotating polishing cloth 12. Here when electrified the electromagnet 19, attractive or repulsive force is generated between the magnet 18 and the electromagnet 19, and this force is overlapped with gravitational force of the weight 15, to adjust a polishing pressure. The polishing pressure can be controlled by an electrification current of the electromagnet 19. |
