| 摘要 |
PURPOSE:To hold a workpiece substrate with no deformation thereof and further to prevent a recessed part from being generated in a substrate surface due to foreign matter sticking to a suction surface, in a polishing device for mirror polishing the semiconductor substrate of silicon wafer or the like. CONSTITUTION:In a holding plate 10 arranged on a rotary carrier 2 and secured by a metal ring 8 communicating with a suction hole 3 in the inside by providing suction hole paths 5 in the surface, many fine grooves 11 of 0.5mm to 1.0mm width and 0.5mm or more depth are engraved concentrically in a substrate suction side of the holding plate, and foreign matter sticking onto a substrate 1 is advanced into the fine grooves 11. Since foreign matter sticking onto a surface of the holding plate 10 is discharged into the fine grooves 11 by brushing or the like, in the sucked substrate, no partial hollow is generated at all due to the foreign matter or the like after polishing. |
