| 摘要 |
<p>PURPOSE:To improve flatness and waterproofness by casting molding one of a transparent board and a protective board formed with optical recording preformat and optical recording layer and an IC module, integrating them, and adhering both the board with adhesive. CONSTITUTION:In order to manufacture a composite card, an IC module 2 is first disposed in molds 1, the molds are assembled by using a spacer 3, epoxy resin is, for example, cast from an inlet 4, solidified, and then released from the molds, thereby forming a board 5 integrated with the module 2. Then, an optical recording layer 7 is arranged on an upper surface of a preformat pattern 6. Thereafter, a protective board 8 in which a hole 9 is similarly opened is adhered to a part corresponding to the module 2 to a side of the layer 7 of the board 5 through adhesive 10 in which a hole 9 is opened at a part corresponding to the module 2. Thus, the card 10 in which a surface state of the board 5 is excellent and no gap exists between the module 2 and the board 5 with excellent waterproofness is obtained.</p> |
