| 摘要 |
PURPOSE: To provide a lead-free, high solidus temp., high strength, multi- component solder alloy. CONSTITUTION: This solder alloy contains at least 90 wt.% Sn and an effective amt. of Ag and Bi, optionally contains Sb or Sb and Cu. Another embodiment of the alloy contains at least 90 wt.% Sn and an effective amt. of Ag and Sn, optionally with a small amt. of bismuth. In this way, the lead-free, high solidus temp., high strength, multicomponent solder alloy can be obtained. |
