发明名称 CERAMIC COMPOSITION FOR MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To reduce the firing temperature of a ceramic composition to make it possible to use a conductive metal paste as an internal electrode by a method wherein the addition amount of Al2O3, which is used as one of the component composition of glass frit, is lessened and the glass frit and titanate, which has a high reactivity to the glass frit, are used for the ceramic composition. CONSTITUTION:60 to 95wt.% of glass frit, which is constituted of a component composition of 40 to 50wt.% of Al2O3, 25 to 30wt.% of SiO2, 7 to 9wt.% of PbO, 5 to 15wt.% of TiO2, 4.4 to 5.3wt.% of the mixture of CaO and MgO, 2.5 to 3.0wt.% of B2O3 and 2.2 to 3.0wt.% of ZrO2, and 5 to 40wt.% of titanate are made to contain in the title ceramic composition. At this time, it is desirable that the titanate consists of SrTiO3 and/or CaTiO3. Thereby, the ceramic composition can be fired at a very low temperature, that is, a low temperature of 750 to 950 deg.C, a paste, such as Au, Ag, Ag-Pd and Cu pastes, can be used as an internal electrode and moreover, the characteristics of a good ceramic board to be formed with electronic circuits in a multilayer can be satisfied.
申请公布号 JPH0786745(A) 申请公布日期 1995.03.31
申请号 JP19930229988 申请日期 1993.09.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIMURA HIROHARU;TOKUNAGA HIROMI;HASEGAWA KENICHI;WATANABE KOICHI
分类号 C04B35/18;H05K1/03;H05K3/46 主分类号 C04B35/18
代理机构 代理人
主权项
地址