发明名称 FORMING METHOD OF FUNCTIONAL COATING FILM OR THE LIKE
摘要 PURPOSE:To provide a production method of a substrate having a functional coating film or the like formed with good accuracy on a conductive circuit. CONSTITUTION:In this method, the following process is successively performed. (a) A positive or negative photoresist is applied to form a coating film 3 on the whole surface of a transparent substrate 1 having a conductive circuit 2. (b) The surface of the coating film 3 is covered with a mask 5, 6 and irradiated with light beams 4 for exposure. This mask has such a pattern that a coating film 3 to cover the area except or the frame part can be formed with this mask in the succeeding developing process. (c)(d) The coating film is developed and heat treated. (e) A negative photoresist containing an additive to give functions is applied to form a coating film 7 on the whole surface of the transparent substrate 1 thus obtd. (f) The film 7 is exposed to light through the back surface of the substrate. (g) The uncured part of the coating film 7 is removed by developing. (h) Only the heat-treated coating film 7 is removed. (i) An electrodeposition coating film 8 is formed on plural window parts an the conductive circuit 2 of the transparent substrate 1 thus obtd.
申请公布号 JPH0784119(A) 申请公布日期 1995.03.31
申请号 JP19930231370 申请日期 1993.09.17
申请人 SUMITOMO CHEM CO LTD;SHINTO PAINT CO LTD 发明人 MIYAZAKI SUSUMU;NAKANO TSUYOSHI;OKADA YOSHIKATSU;YASUKAWA JUNICHI;MATSUMURA YOSHINORI;TSUEDA KAZUO
分类号 G02B5/20;G02F1/1335;G03F7/20;H05K3/00;H05K3/24 主分类号 G02B5/20
代理机构 代理人
主权项
地址