发明名称 |
FORMING METHOD OF FUNCTIONAL COATING FILM OR THE LIKE |
摘要 |
PURPOSE:To provide a production method of a substrate having a functional coating film or the like formed with good accuracy on a conductive circuit. CONSTITUTION:In this method, the following process is successively performed. (a) A positive or negative photoresist is applied to form a coating film 3 on the whole surface of a transparent substrate 1 having a conductive circuit 2. (b) The surface of the coating film 3 is covered with a mask 5, 6 and irradiated with light beams 4 for exposure. This mask has such a pattern that a coating film 3 to cover the area except or the frame part can be formed with this mask in the succeeding developing process. (c)(d) The coating film is developed and heat treated. (e) A negative photoresist containing an additive to give functions is applied to form a coating film 7 on the whole surface of the transparent substrate 1 thus obtd. (f) The film 7 is exposed to light through the back surface of the substrate. (g) The uncured part of the coating film 7 is removed by developing. (h) Only the heat-treated coating film 7 is removed. (i) An electrodeposition coating film 8 is formed on plural window parts an the conductive circuit 2 of the transparent substrate 1 thus obtd. |
申请公布号 |
JPH0784119(A) |
申请公布日期 |
1995.03.31 |
申请号 |
JP19930231370 |
申请日期 |
1993.09.17 |
申请人 |
SUMITOMO CHEM CO LTD;SHINTO PAINT CO LTD |
发明人 |
MIYAZAKI SUSUMU;NAKANO TSUYOSHI;OKADA YOSHIKATSU;YASUKAWA JUNICHI;MATSUMURA YOSHINORI;TSUEDA KAZUO |
分类号 |
G02B5/20;G02F1/1335;G03F7/20;H05K3/00;H05K3/24 |
主分类号 |
G02B5/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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