| 摘要 |
PURPOSE:To obtain a small and thin CCD chip whose light receiving region is protected by a glass substrate by method wherein wire patterns connected to electrode pads are formed on the upper surface of the glass substrate and joint parts including bumps are provided on the lower surface of the CCD chip and the joint part of the glass substrate and the joint part of the CCD chip are jointed with anisotropic conductive adhesive. CONSTITUTION:The joint part of a CCD chip 11 including bumps 12 is joined to the joint part of a glass substrate 21 including electrode pads 22 with anisotropic conductive adhesive 31 by thermocompression bonding. The anisotropic conductive adhesive 31 is an insulating adhesive 32 made of thermosetting or thermoplastic resin and conductive particles 33 mixed into the insulating adhesive 32. As the light transmitted through the glass substrate 21 is applied to a light receiving region 13 on the lower surface of the CCD chip 11, the light receiving region 31 of the CCD chip 11 is protected by the glass substrate 21. Further, only one joining step using the anisotropic conductive adhesive 31 is carried out regardless of the number of connection terminals, so that the step time can be shortened and the cost can be reduced. |
