| 摘要 |
PURPOSE:To facilitate the automatic mounting step of all components such as wiring boards and photoelectric transducers by a method wherein a device row composed of a plurality of the photoelectric transducers arranged linearly and a board row composed of a plurality of the wiring boards corresponding to the photoelectric transducers which are arranged in one row are provided on one support board with a certain spacing between each other. CONSTITUTION:A plurality of LED chips 2 are die-bonded onto a long support board 1 having a required length in its longitudinal direction linearly and at approximately uniform intervals by automatic mounting. Further, a plurality of wiring boards 3 are mounted on the support board 1 in parallel with the device row of the LED chips 2 lineraly at certain spacings between each other so as to have a one-to-one correspondence to a plurality of the LED chips 2 at uniform intervals by automatic mounting. Moreover, driving ICs 4 for driving the LED chips 2 are arranged on the support board 1 between the row of the LED chips 2 and the row of the wiring boards 3 so as to have a one- to-one correspondence to the LED chips 2 by automatic mounting. |
