| 摘要 |
PURPOSE:To provide a thinned semiconductor package having a high heat- radiant characteristic and its manufacturing method. CONSTITUTION:As a lead frame 14 and a semiconductor element are arranged on an internal side of a heat-radiant plate 10 formed to be a trapezoid and sealed with a resin seal body 16, the heat sink 10 exposes to the entire surface, whereby a high heat-radiant characteristic can be obtained. Also, the lead frame 14 needs only single-sided resin sealing, whereby a thickness in a package can be thinned. Also, as the lead frame 14 needs only single-sided resin sealing, the resin seal body 16 can vertically be filled from upwardly of the semiconductor element and it is possible to prevent an unfilling of the resin seal body 16 and a generation of a wire flow of a bonding wire 15. |
