发明名称 MULTILAYER CERAMIC CIRCUIT BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE:To make it possible to form a fully degreased and dense insulating layer by a method wherein green sheets split into a plurality of groups are laminated to degrease and the green sheets are laminated in every group to press and fire. CONSTITUTION:A plurality of sheets of ceramic uncalcined green sheets, which respectively have a circuit pattern formed on their surfaces with a conductive paste, are stacked in order to hold the upper and lower surfaces of the upper and lower green sheets of the green sheets between porous plates 1 consisting of an alumina material and the green sheets are thermally pressure bonded from the upper and lower surfaces using a heat pressing machine or the like. Moreover, the plurality of sheets of the thermally pressure bonded green sheets are heated to degrease and are fired. Whereupon a multilayer board 2a is obtained. Then, a plurality of sheets of the multilayer boards 2a formed in the same manner are superposed, the upper and lower surfaces of the upper and lower boards of the boards 2 are held between the porous plates 1 consisting of the alumina material and moreover, the boards 2 are fired while a pressing force is applied from over the boards. As a result, a multilayer ceramic board of a structure, wherein the plurality of sheets of the boards 2a are integrally constituted into a plurality of layers, is completed. In such a way, if a degreasing is performed in every small group, an efficiently full degreasing becomes possible.
申请公布号 JPH0786740(A) 申请公布日期 1995.03.31
申请号 JP19930248574 申请日期 1993.09.10
申请人 HITACHI LTD 发明人 KATO SHUJI;OGAWA TOSHIO;KAMIMURA NORITAKA;HASEGAWA MITSURU
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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