TESTING EQUIPMENT FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To simplify a burn-in test protecting a bump electrode against oxidation. CONSTITUTION:A testing equipment is composed of a substrate 11 mounted with a semiconductor device 15 with bump electrodes 16, an outside air cutoff mechanism 13 which shuts off the semiconductor device 15 mounted on the substrate 11 from the outside air, and a lead wire 14 which is connected with the bump electrode 16 of the semiconductor device 15 provided inside the outside air cutoff mechanism 13 so as to electrically lead the electrode 16 out of the outside air cutoff mechanism 13. The outside air cutoff mechanism 13 is composed of a lid 12 which is provided confronting the substrate 11 and an O-ring 20 which is interposed between the substrate 11 and the lid 12 surrounding the substrate device 15 so as to form an outside air cutoff chamber 24.