| 摘要 |
PURPOSE:To improve heat radiation of a semiconductor device having a flat package. CONSTITUTION:A die stage 10, to which an IC chip is adhered, is made to be exposed on one side main surface of a flat package 16 in a semiconductor device such as an integrated circuit device. A mounting board 20 is provided with a recess 22 for housing the package 16, and the recess 22 is provided with a heat sink 24 in the bottom. At the time of mounting, the package 16 is inserted into the recess 22 of the package 16, a die stage 10 exposed from the package 10 exposed the package underside is adhered to the heat sink 24 by a solder layer S2. |
