DAM BAR CUTTING METHOD AND LASER PROCESSING DEVICE

摘要

PURPOSE:To provide a dam bar cutting method by which leads can be prevented from becoming thinner after cutting due to scraped out sections formed on the leads and adhesion of dross to the leads can be reduced and a laser processing device used for the dam bar cutting method. CONSTITUTION:At the time of cutting a dam bar 22 which intercepts the flow of a molding resin 21 by using a laser beam emitted from a nozzle 5 together with an assist gas during the manufacturing process of a semiconductor device 2, in which a semiconductor chip is mounted on a lead frame 20 and the chip and frame 20 are integrally sealed with the resin 21, the blowing direction of the assist gas is inclined toward the resin 21. Therefore, the opening of the front end section 5a of the nozzle 5 is inclined toward the resin 21. In addition, the opened direction of the section 5a is rotated in coincident with the position where the the resin 21 exists.