发明名称 |
LAMINATED HYBRID INTEGRATED CIRCUIT COMPONENT |
摘要 |
<p>PURPOSE:To provide a multilayered hybrid integrated circuit component having a means for protecting malfunction of a mounted semiconductor component, by reducing the noise generated by the action of a laminated inductor or a laminated capacitor and a land. CONSTITUTION:A laminated inductor 1A wherein a transformer is formed by alternately laminating insulator layers 2 and conductive layers 3 is constituted. A laminated capacitor is laminated on the laminated inductor 1A, or individually consituted as a capacitor formed by alternately laminating dielectric layers and electrode layers. A semiconductor component 8 is mounted on the above laminated component. A shield layer 15 is formed interposing an insulator layer 16 under a land 7 with which the lead 9 of the semiconductor component 8 and/or a land with which other constituent components relative to the semiconductor components are connected. Further a shield layer 15 may be formed under a resistance layer connected directly or indirectly with the semiconductor component 8.</p> |
申请公布号 |
JPH0786754(A) |
申请公布日期 |
1995.03.31 |
申请号 |
JP19930253810 |
申请日期 |
1993.09.16 |
申请人 |
TDK CORP |
发明人 |
MOCHIZUKI NOBUNORI;MANOME CHISATO;ORIHARA MASASHI |
分类号 |
H05K3/46;H05K9/00;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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