发明名称 LAMINATED HYBRID INTEGRATED CIRCUIT COMPONENT
摘要 <p>PURPOSE:To provide a multilayered hybrid integrated circuit component having a means for protecting malfunction of a mounted semiconductor component, by reducing the noise generated by the action of a laminated inductor or a laminated capacitor and a land. CONSTITUTION:A laminated inductor 1A wherein a transformer is formed by alternately laminating insulator layers 2 and conductive layers 3 is constituted. A laminated capacitor is laminated on the laminated inductor 1A, or individually consituted as a capacitor formed by alternately laminating dielectric layers and electrode layers. A semiconductor component 8 is mounted on the above laminated component. A shield layer 15 is formed interposing an insulator layer 16 under a land 7 with which the lead 9 of the semiconductor component 8 and/or a land with which other constituent components relative to the semiconductor components are connected. Further a shield layer 15 may be formed under a resistance layer connected directly or indirectly with the semiconductor component 8.</p>
申请公布号 JPH0786754(A) 申请公布日期 1995.03.31
申请号 JP19930253810 申请日期 1993.09.16
申请人 TDK CORP 发明人 MOCHIZUKI NOBUNORI;MANOME CHISATO;ORIHARA MASASHI
分类号 H05K3/46;H05K9/00;(IPC1-7):H05K3/46 主分类号 H05K3/46
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