Highly heat-resistant relief structures

摘要

In order to produce highly heat-resistant relief structures, soluble oligomeric and/or polymeric hydroxypolyimides or polyphenylquinoxalines are applied in the form of a layer or film to a substrate, then exposed through a mask by means of pulsed UV laser radiation with a power density of > 10<5> W.cm<-2> at a wavelength of < 300 nm, and subsequently developed.