| 摘要 |
A quartz surface is bonded to a metallic surface such as stainless steel. The method involves the sequential vacuum evaporation of chromium, copper and chromium, and copper onto the quartz surface to form in superposition, a chromium film, a copper-chromium film, and a copper film in that order on the quartz surface. The quartz surface bearing these superimposed films is then placed in electrical and physical contact with the stainless steel surface to which it is to be bonded and immersed in an electroplating solution of an electroplatable metal. An electrode composed of said electroplatable metal is also immersed in the electroplating solution. The exposed stainless steel surface is then electrically connected to the negative terminal of a suitable power supply, and the electrode of said electroplatable metal electrically connected to the positive terminal of the power supply. A variable current limiting resistor and milliammeter are series connected to the terminals of the power supply and a suitable plating current is then passed through the solution.
|
