SEALING STRUCTURE AND SEALING METHOD FOR ELECTRONIC COMPONENT,申请号JP19930175973-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	SEALING STRUCTURE AND SEALING METHOD FOR ELECTRONIC COMPONENT
摘要
申请公布号	JPH0786085(A)	申请公布日期	1995.03.31
申请号	JP19930175973	申请日期	1993.06.22
申请人	SUMITOMO WIRING SYST LTD	发明人	UCHIYAMA TAKAHIRO
分类号	H01G4/224;H01G4/35;(IPC1-7):H01G4/224	主分类号	H01G4/224
代理机构		代理人
主权项
地址

您可能感兴趣的专利

BOUNDARY LAYER CONTROL SYSTEM FOR AIRCRAFT

Improvements in or relating to leg guards

RADICAL POLYMERISATION PROCESS AND ADDITIVES FOR SYNTHETIC RESINS SO PREPARED

Electrical keyswitch

FREMGANGSMAADE TIL AT GENVINDE ROEGGAS FRA KEDLER I ANLAEG TIL FREMSTILLING AF ELEKTRISK KRAFT VED ANVENDELSE AF BRAENDBART MATERIALE SOM BRAENDSEL OG ET APPARAT TIL UDOEVELSE AF EN SAADAN FREMGANGSMAADE

ADJUSTABLE EASY CHAIR

METHOD OF PREPARING A VINCA DIMER

DIOXOLANE DERIVATIVES

2,4-diaryl Thiazol-5-yl-acetic Acids

Electro-acoustic transducer

Secondary radar

Improvements in or relating to alternating current generators

Hands-free telephone circuit

Improvements in or relating to circuit arrangements for checking operation of time division telephone exchange line control units

Engine-alternator sets

Security system

Flat cooling plates or boxes for blast furnace walls

NON-VOLATILE EPROM CELL