Herstellungsverfahren von Rasterlinien auf einem wafer.

摘要

A process for forming dicing lines on a wafer which comprises : exposing a wafer region in which a dicing line pattern has not been formed to light irradiated through and patterned by a reticle (11) for forming dicing lines; the reticle having nonpatterned region (12) of the same size as a device pattern region of a reticle for forming a device pattern on the wafer and a dicing zone (13) which is in contact with the periphery of the nonpatterned region.