发明名称 LASER CUTTING APPARATUS
摘要 <p>An apparatus (10) for cutting a material (40) having a thickness, T, defined by the distance between a first surface (46) and a second surface (42) of the material (40). The apparatus (10) comprises an energy source (12) for providing a beam of energy (14), and directing mirrors for directing the beam of energy from the energy source to a first focal point (80) between the first and second surfaces (46, 42) of the material, and to a second focal point (98) between the first and second surfaces (46, 42) of the material (40). The first and second focal points (80, 98) are spaced apart from each other by a distance sufficient to cut through the entire thickness of the material (40).</p>
申请公布号 WO1995008414(A1) 申请公布日期 1995.03.30
申请号 US1994010489 申请日期 1994.09.15
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