| 摘要 |
<p>The subject of the application pertains to a structure consisting of a cooling component (KB) which has on one side (S) a pan-shaped cavity with an inlet (E) and an outlet (A) for a liquid coolant and on which a metal base plate (M) of the power semiconductor module is mounted so that the metal base plate completely seals off the pan-shaped cavity, with the metal base plate itself forming part of the cooling device. The advantages are primarily those of low weight, low heat transmission resistance between module and coolant despite a detachable connection between module and cooling component and applicability in commercially available standard power semiconductor modules.</p> |
