发明名称 Production method for a nitrided silicon oxide layer with reduced thermal loading
摘要 A nitrided silicon oxide layer, which is required, for example, for very thin, reliable gate oxides and tunnelling oxides, is produced, with reduced thermal loading, in a RTP method in a gas mixture which contains an oxygen-containing and a nitrogen-containing gaseous substance. Particularly preferred gas mixtures are O3 + N2 or O2 + NH3. A possibly required second RTP step for subsequent treatment is preferably carried out in O3 and/or N2O, as a result of which the thermal loading can likewise be reduced.
申请公布号 DE4333160(A1) 申请公布日期 1995.03.30
申请号 DE19934333160 申请日期 1993.09.29
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 KAKOSCHKE, RONALD, DR.RER.NAT., 81475 MUENCHEN, DE;GSCHWANDTNER, ALEXANDER, DR.PHIL., 80687 MUENCHEN, DE;BUSMANN, EGON, DR.RER.NAT., 81545 MUENCHEN, DE
分类号 H01L21/28;H01L21/314;H01L29/51;(IPC1-7):H01L21/314;H01L21/822 主分类号 H01L21/28
代理机构 代理人
主权项
地址