摘要 |
A nitrided silicon oxide layer, which is required, for example, for very thin, reliable gate oxides and tunnelling oxides, is produced, with reduced thermal loading, in a RTP method in a gas mixture which contains an oxygen-containing and a nitrogen-containing gaseous substance. Particularly preferred gas mixtures are O3 + N2 or O2 + NH3. A possibly required second RTP step for subsequent treatment is preferably carried out in O3 and/or N2O, as a result of which the thermal loading can likewise be reduced.
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申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
KAKOSCHKE, RONALD, DR.RER.NAT., 81475 MUENCHEN, DE;GSCHWANDTNER, ALEXANDER, DR.PHIL., 80687 MUENCHEN, DE;BUSMANN, EGON, DR.RER.NAT., 81545 MUENCHEN, DE |