IMMERSION TESTING POROUS SEMICONDUCTOR PROCESSING COMPONENTS

摘要

To permit immersion ultrasonic testing of a semiconductor processing component (12) manufactured of porous metal, a cover (10) is sealed over the processing surface of the component. The cover creates an acoustically reflective air gap between the cover and the processing surface. Ultrasonic waves scanned across the component reflect from this gap, creating an image of the internal structure of the component.