发明名称 Optical semiconductor device
摘要 An optical semiconductor device (50), comprising an element (4) selected from a light-sensitive semiconductor element, a light-emitting semiconductor element, a light-sensitive and light-emitting semiconductor element, and a housing for closing off the semiconductor element (4) in air-tight fashion. The housing includes a window (1) comprising silicon, which selectively transmits light incident on the semiconductor element or emitted by the semiconductor element. The Si window (1) is connected to the housing body (3) by using a solder (2) which forms a eutectic alloy with the silicon. In this structure, the contact point is not detrimentally affected by external influences, since the eutectic alloy is produced at the connection point of the Si window (1) and of the housing body (3). Since the Si window (1) furthermore transmits no light in the visible range, the interior of the housing cannot be viewed from outside through the Si window after production of the device. For this reason, a finished device is not assessed as faulty merely because of its abnormal appearance, due to an irregular arrangement of the elements included in the housing, as a result of which productivity is increased. Furthermore, since the Si window (1) by using a conventional Si wafer and an apparatus as in a conventional wafer method for ... Original abstract incomplete. <IMAGE>
申请公布号 DE4433521(A1) 申请公布日期 1995.03.30
申请号 DE19944433521 申请日期 1994.09.20
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 KAGAWA, HITOSHI, ITAMI, HYOGO, JP;YAMASHITA, KOJI, ITAMI, HYOGO, JP
分类号 H01L23/28;H01L21/56;H01L23/02;H01L31/0203;H01L31/0216;H01S5/00;H01S5/022 主分类号 H01L23/28
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