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发明名称
A method for forming solid conductive vias in substrates
摘要
申请公布号
IL112294(D0)
申请公布日期
1995.03.30
申请号
IL19950112294
申请日期
1995.01.10
申请人
WATKINS-JOHNSON COMPANY
发明人
分类号
H01L21/48;H05K1/03;H05K3/00;H05K3/10;H05K3/38;H05K3/40;H05K3/42;(IPC1-7):H01L
主分类号
H01L21/48
代理机构
代理人
主权项
地址
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