发明名称 |
Semiconductor device having semiconductor chip with backside electrode. |
摘要 |
A semiconductor chip (11) is mounted on a chip-mounting section (12). A conduction path forming section (20) having a plurality of conduction paths (24) formed therein is placed around the chip-mounting section (12). A heat sinking board (14) is bonded to the backsides of the chip-mounting section (12) and the conduction path forming section (20). In the conduction path forming section (20), a second insulating layer (22) is formed with notches (25), whereby the exposed area of conduction paths (24) that are wire-bonded to the chip-mounting section (12) is increased. <IMAGE> |
申请公布号 |
EP0645811(A2) |
申请公布日期 |
1995.03.29 |
申请号 |
EP19940115009 |
申请日期 |
1994.09.23 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOZONO, HIROYUKI, C/O INTELLECTUAL PROPERTY DIV. |
分类号 |
H01L23/12;H01L23/13;H01L23/36;H01L23/498 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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