Process for producing modified phenolic resin, molding material based on modified phenolic resin, and material for electrical or electronic parts and semiconductor sealant compounds each produced utilizing the molding material.

摘要

The present invention relates to a novel improved process for producing a modified phenolic resin. This process comprises extracting a polycondensation reaction product with a specific extraction solvent, optionally performing a neutralization treatment, to thereby produce a modified phenolic resin containing substantially no acid so that it does not corrode metal. In combination with an epoxy resin, the modified phenolic resin provides a resin molding having excellent electrical insulating properties and thermal and moisture resistances. An advantageous molding material based on the modified phenolic resin and an advantageous material for electrical or electronic parts and semiconductor sealant each produced utilizing the molding material are provided by the present invention.