| 摘要 |
A stage mechanism usable in a semiconductor device manufacturing apparatus, for carrying and positioning a semiconductor wafer with high accuracy and at high speed, is disclosed. The stage device includes a reference portion and a stage portion resiliently supported by the reference portion. Further, a solid damper such as a rubber member is disposed between the reference portion and the stage portion, so as to provide a resistance to the displacement of the stage portion. Thus, with the disclosed device, any residual vibration of the stage portion after the displacement of the stage can be damped quickly, with a simple and compact structure. |
