Vapour film deposition chamber - with conical plasma subchamber

摘要

Noble gas filled chamber for the deposition of films by cathode sputtering comprises a conical plasma chamber into which are set inverted funnel shaped cathode surfaces in the smaller upper opening of which is fitted the anode and the larger opening faces the deposition subchamber. The deposition subchamber contains a cathode plate on which the substrate are placed. The chamber permits the deposition of thick films.