| 摘要 |
This invention is a method for making a semiconductor integrated circuit chip, adapted for mounting to a lead-over-chip lead frame, comprising the steps of (a) applying a uniform coating of an adhesive having a number average molecular weight in the range of 5,000 to 50,000 to a thickness of 0.1-5 mils to the surface of a silicon wafer that is detailed for microelectronics circuitry; (b) removing selected portions of the adhesive to expose bond pads on the surface of the wafer; (c) dicing the wafer to form individual semiconductor integrated circuit chips; (d) electrically and adhesively connecting the chips to a lead frame; (e) encapsulating the chip and the lead frame in a polymeric sealant. |
