| 摘要 |
Lands formed on the top surface of substrate are covered by a printing screen having a printing pattern, in order to mount chip components on the substrate. A paste bonding agent is supplied to the lands through the printing pattern, and a layer of bonding agent is formed on the lands. In the printing method, a plurality of bonding agent layers that are mutually separated are formed on the land. The chip component is placed on the bonding agent layers of the land. As the chip component is pressed to the land, the bonding agent layers are smashed and spread on the land prior to applying heat to said bonding agent layers.
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