发明名称 |
Electronic component heat sink attachment using a canted coil spring |
摘要 |
A thermal attachment assembly for heat generating electronic devices which uses a canted coil spring to apply pressure directly against electronic components. The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against a surface of a shoulder or side wall of the heat sink housing. The force of the canted coil spring can be counterbalanced by a cover for the housing, or by an abutment that is either fixed in the housing or floats between attachment and an assembly at each of opposite sides of the housing.
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申请公布号 |
US5402313(A) |
申请公布日期 |
1995.03.28 |
申请号 |
US19930064643 |
申请日期 |
1993.05.21 |
申请人 |
CUMMINS ENGINE COMPANY, INC. |
发明人 |
CASPERSON, PAUL G.;DURBIN, MICHAEL |
分类号 |
H01L23/40;H05K5/00;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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