发明名称 Arrangement for extracting heat from a printed circuit board which has at least one heat sink
摘要 In the case of an arrangement for extracting heat from a printed circuit board (10) which has at least one heat sink (15) and is fitted with electrical components (11) which produce heat and whose connecting contacts (12) conduct the heat into conductor tracks (13, 14), reliable heat dissipation is achieved in a simple manner in that the heat sink (15) is connected detachably, in an electrically insulated manner and in a thermally conductive manner, to at least two conductor tracks (13, 14) at different potentials.
申请公布号 DE4332115(A1) 申请公布日期 1995.03.23
申请号 DE19934332115 申请日期 1993.09.22
申请人 PHILIPS PATENTVERWALTUNG GMBH, 20097 HAMBURG, DE 发明人 KARCH, MARTIN, 91171 GREDING, DE;KOCH, WOLFGANG, 90431 NUERNBERG, DE
分类号 H01L23/40;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
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