MULTI-CHIP MODULE

摘要

Bare IC chips (201 through 203) are mounted on respective areas (101 through 103) of a printed wiring board (100). The outer electrode Pads (105) on the peripheries of the board (100) are soldered to another printed wiring board (1) such as a mother board. Lead pads (107) and the outer electrode Pads (105) are interconnected through a circuit pattern (109), through holes (111) and interstitial via holes (112). The circuit pattern (109) is disposed on a die bonding surface of the bare IC chips (201 and 202) for which insulation is not necessary. A multi-chip module is thus completed.