发明名称 Dispersion strengthened copper-base alloy for overlay.
摘要 <p>A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %, Ni: 5 to 30%; B: 0.5 to 3%; Si: 1 to 5%; Fe: 4 to 30%; Sn: 3 to 15% and/or Zn: 3 to 30%; and the remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti maybe further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base alpha phase dendrites and serve as a solid lubricant.</p>
申请公布号 EP0411882(B1) 申请公布日期 1995.03.22
申请号 EP19900308374 申请日期 1990.07.30
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 TAKAGI, SOYA, C/O TOYOTA JIDOSHA K.K.;MORI, KAZUHIKO, C/O TOYOTA JIDOSHA K.K.;KAWASAKI, MINORU, C/O TOYOTA JIDOSHA K.K.;KATO, SHINJI, C/O TOYOTA JIDOSHA K.K.
分类号 B23K35/30;C22C9/06;C22C9/10;(IPC1-7):B23K35/30;C22C9/00;C22C32/00 主分类号 B23K35/30
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