| 摘要 |
A heat sink (13) is attached to a semiconductor element (11) functioning as an exothermic element, which is mounted on a circuit board (15) and has a predetermined allowable power consumption, thereby cooling the semiconductor element (11). A semiconductor element (12) having a lower allowable power consumption than the semiconductor element (11) having the predetermined power consumption, which is hardly exposed to a cooling air flow cooled via the heat sink (13), is connected to a heat conductive auxiliary member (14) connected at one end to the heat sink (13). Thus, the heat radiation efficiency of the semiconductor element (12) having the lower allowable power consumption is enhanced. <IMAGE> |
