发明名称 |
Thermal conduction module. |
摘要 |
<p>An otherwise conventional multi-chip circuit module called a thermal conduction module (TCM) is provided with "barrel shaped" pistons (22) that give improved cooling for chips (15) that may be tilted with respect to their pistons. The piston has a cylindrical mid-section (32) and tapered end sections (33, 34). The barrel shape permits the piston to tilt with the chip even though the mid-section has the desirable close fit of conventional convex face pistons. The length of the mid-section is selected to permit the piston to tilt to the angle of the taper of the ends. Because the piston can tilt with the chip, the end (29) that contacts the chip is flat for good heat transfer. The result is improved heat transfer by a lower combined thermal resistance of the gap between piston and chip and the gap between piston and hat versus conventional pistons.</p> |
申请公布号 |
EP0369115(B1) |
申请公布日期 |
1995.03.22 |
申请号 |
EP19890114145 |
申请日期 |
1989.08.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GOTH, GARY FRANKLIN;MORAN, KEVIN PATRICK;ZUMBRUNNEN, MICHAEL LYNN |
分类号 |
H05K7/20;H01L23/36;H01L23/433;H01L23/473;(IPC1-7):H01L23/433 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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