| 摘要 |
An insulating substrate for mounting semiconductor devices thereon comprises: an alumina (Al2O3) insulating member (1) having first and second opposite flat surfaces (5, 6) terminating at an end surface (4) of the member (1), a first sheet (2) of metallic foil disposed on the first surface (5) having edges terminating first predetermined distances (A) inwardly of said end surface (4), a second sheet (3) of metallic foil disposed on the second surface (6) having edges terminating second predetermined distances (B) inwardly of the end surface (4), said first and second predetermined distance increasing the distance between the edges of the first and second sheets (2, 3) of metallic foil by an amount greater than the thickness of the insulating member (1) and the difference between the first and second predetermined distances being substantially no greater than 0.5 mm to balance thermal stress on the opposite flat surfaces of the insulating member (1). The foils may have an overlapping pattern. <IMAGE> |
