| 摘要 |
Photosensitive resin compositions which can be used to prepare solder masks of improved stability are provided, together with a method of forming a cured, imagewise distribution of the solder mask composition on a printed circuit board substrate. Such composition are radiation curable and comprise a partial ester of a hydroxyalkyl (meth)acrylate and a styrene-maleic anhydride copolymer, a multifunctional (meth)acrylate monomer, a photoinitiator and a multifunctional epoxide.
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