| 摘要 |
<p>PURPOSE:To provide a wafer retainer for plasma CVD which can set a semiconductor wafer at a specified position, without rubbing against the main surface of the semiconductor wafer except a peripheral margin part. CONSTITUTION:A wafer retainer 1 is used when a film is sequentially formed on each of the surfaces of a semiconductor wafer by a plasma CVD method. A recessed part 1a having an U-shaped contour which is a little smaller than the outer diameter of the wafer is formed on the mounting surface of the retainer 1. Guide pawls 3 for engaging and retaining the semiconductor wafer at a specified position are discretely arranged on the periphery of the recessed part. Thereby the semiconductor wafer can be set at a specified position while the inner peripheral region of the main surface except an outer peripheral margin part is not in contact with the wafer retainer.</p> |
