| 摘要 |
PURPOSE:To integrate semiconductor devices on one chip, actually allow downsizing and high-integration, remarkably reduce the manufacturing cost compared with the conventional composite semiconductor devices and improve the reliability and the yield of products. CONSTITUTION:A composite semiconductor device is composed of the following semiconductor devices: a logic circuit 11, a CPU 12, DRAM 13 and a flash memory 14. On the function plane 11a of the logic circuit 11 which has the largest function plane, the function planes of other semiconductor devices, the CPU 12, the DRAM 13 and the flash memory 14, are laminated by using solder so as to connect wires and composite the devices as one chip. |
