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发明名称
REFLOW SOLDERING EQUIPMENT
摘要
申请公布号
JPH0779072(A)
申请公布日期
1995.03.20
申请号
JP19930223352
申请日期
1993.09.08
申请人
NIPPON DENNETSU KEIKI KK
发明人
IMAI MASAAKI
分类号
C23C2/34;H01L21/52;H05K3/34;(IPC1-7):H05K3/34
主分类号
C23C2/34
代理机构
代理人
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地址
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