发明名称 METAL PLATE POLISHING DEVICE
摘要 PURPOSE:To polish the surface of a metal plate continuously and stably for many hours so as to obtain excellent surface properties by providing a polishing liquid supply means with an abrasive grain concentration controller for making the concentration of abrasive grain in polishing liquid coincide with the target value. CONSTITUTION:The surface of a metal plate 15 is continuously polished by polishing rolls 1 with the peripheral surface covered with an elastic injected body, and polishing liquid 20 containing abrasive grain, from nozzles 3. The abrasive grain 21 and water are mixed in the mixing tank 12 of a polishing liquid supply means to prepare the polishing liquid 20, and this polishing liquid 20 is circulated as jet flow in the mixing tank 12 by a polishing liquid circulating machine 23b. This jet flow is made collide with a baffle plate 12a to make the polishing liquid 20 turbulent flow so that the abrasive grain is uniformly suspended to keep the concentration always uniform. The quantity of abrasive grain charged into the mixing tank 12 is measured by the automatic sand weighing apparatus 13 of an abrasive grain concentration controller. On the basis of the measured value, the quantity of water to be charged into the mixing tank 12 is computed by abrasive grain concentration control gauges 14, and the quantity water is regulated and maintained so that the concentration of abrasive grain in the polishing liquid coincides with an objective value.
申请公布号 JPH0775950(A) 申请公布日期 1995.03.20
申请号 JP19930246459 申请日期 1993.09.07
申请人 NKK CORP;HOTANI:KK 发明人 NASU SHOGO;BABA YUTAKA;HOTANI SETSUO
分类号 B24B7/12;B24B29/00;B24B57/02;(IPC1-7):B24B7/12 主分类号 B24B7/12
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