| 摘要 |
<p>PURPOSE:To realize a high density internal circuit while facilitating free modification of routing by supporting a FPC band while erecting and bringing a terminal metal applied to a cover into contact, at the FPC joint thereof, into contact with the conductor of the FPC band. CONSTITUTION:FPC bands D1, D2 are fitted, while being erected to expose about half thereof, in an FPC supporting groove 4 made in a lower cover A thus bringing a terminal metal C previously fixed to the connector housing part 1, at the FPC joint 8 thereof, into immediate contact with a printed wiring conductor. The lower cover A is then coupled with an upper cover B and terminal metals C, C' previously fixed thereto are brought into immediate contact with the printed wiring conductors of the FPC bands D1, D2. This structure realizes high density internal circuit and easy modification of routing.</p> |
