| 摘要 |
PURPOSE:To avoid package cracking by a method wherein plural inner leads are bonded onto a semiconductor chip using a coat layer comprising a specific polyimide base resin as a bonding agent to be connected using bonding wires further sealed with a sealing resin. CONSTITUTION:This resin sealed semiconductor device is provided with a coat layer comprising polyimide base resin represented by the right side foumulas on a circuit element forming surface of a semiconductor chip to bond plural inner leads onto the semiconductor chip using the coat layer as a bonding agent while the plural inner leads are connected to the semiconductor chip using bonding wires to be sealed with a sealing resin. In the formulas, A represents one kind of compound selected from -O-, -SO2-, -CO-, -C(CH2)-,-C(CF3)2- etc., Z represents a bivalent organic radical, R1, R2 represent bivalent aliphatic radical in carbon atoms of 1-5 or aromatic radical in carbon atoms exceeding 6. Furthermore, R3, R4 represent univalent aliphatic radical or aromatic radical in atoms exceeding 6 while n=1-13, 0.01<=b/(a+b)<=0.3. Meeting the requirements, package cracking can be avoided. |
