| 摘要 |
<p>PURPOSE:To prevent a resist, which is removed by a development, from adhering and remaining on the rear of a wafer in the wafer which goes through a resist development process. CONSTITUTION:A gas blowing groove 21 is formed in such a way as to surround a groove 26 for evacuation formed in a head main body 20. The outer peripheral part 24 of the groove 21 is formed lower than the inner peripheral part 25 of the groove 21. When a wafer is vacuum-sucked the main body 20 and a developing, a rinsing and the like are performed, a resist, which is inclined to creep on the rear of the wafer, is blown away by blowing gas made to jet through the groove 21 and the clean rear is maintained. Accordingly, as the resist, which functions as an insulator, is not adhered on the rear of the wafer, a semiconductor device is manufactured at a high yield.</p> |
